MECHANIC UV-559 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair

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MECHANIC UV-559 BGA Lead-free Solder Paste for BGA CPU SMD Rework Repair

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₨490.00

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MECHANIC UV-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball.With Three Nozzles

Available : 10 Sold : 0

10 in stock

₨490.00

Available : 10 Sold : 0

10 in stock

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MECHANIC UV-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball. With Three Nozzles Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals MECHANIC UV-559 as a leave-in help paste residue color is very light, very high SIR value, recommended for BGA, CSP ball array solder joint repair ball. With Three Nozzles Play in the welding process: remove oxides and reduce the surface tension of the material to be welded two main effects paste chemicals

Category: Automotive Electronics. 530

Category: Automotive Electronics (530)

Weight 0.1 kg
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